Hideki Murase
3Patents
3h-index
8Co-inventors
36Inventor score
Filing activity: May 12, 1997 → Nov 2, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6010768A | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler | Emerging Cross-Sectional Technologies | 43 | Expired |
| US6251502A | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler | Emerging Cross-Sectional Technologies | 37 | Expired |
| US6217988A | Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler | Emerging Cross-Sectional Technologies | 22 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.