Inventor · Osaka, JP

Hiroki IWASE

1Patents
1h-index
1Co-inventors
22Inventor score

Filing activity: Nov 22, 2004 → Nov 22, 2004

Most-cited inventions

PatentTitleAreaCited byStatus
US7677414B2 Device for applying foamed hot melt adhesive, and method for selectively applying foamed hot melt adhesive and solid hot melt adhesive Performing Operations; Transporting 2 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.