Hong-Sub Joo
2Patents
0h-index
2Co-inventors
21Inventor score
Filing activity: Jul 15, 2019 → Dec 23, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10903177B2 | Method of manufacturing a semiconductor package | Electricity | 0 | Active |
| US11594500B2 | Semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.