Hui Ding
9Patents
1h-index
43Co-inventors
47Inventor score
Filing activity: Mar 18, 2008 → Jun 7, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10163762B2 | Lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting | Electricity | 1 | Active |
| US10345197B2 | Loading test test-and-control system and method of vehicle lifter lifting unit | Physics | 1 | Active |
| US7768104B2 | Apparatus and method for series connection of two die or chips in single electronics package | Electricity | 1 | Active |
| US10639710B2 | Melting pot, and float salvaging apparatus and method for melting pot | Emerging Cross-Sectional Technologies | 0 | Active |
| US8783145B2 | Apparatus for stripping metal sheets from cathode blank | Emerging Cross-Sectional Technologies | 0 | Active |
| US9540221B2 | Self-adjusting supporting head | Performing Operations; Transporting | 0 | Active |
| US9016209B2 | Transverse adjustment mechanism for bilateral half-spring type load-carrying head | Emerging Cross-Sectional Technologies | 0 | Active |
| US9041188B2 | Axial semiconductor package | Electricity | 0 | Active |
| US9527708B2 | Segmented inverting cover plate apparatus for underfloor vehicle lifting jack | Fixed Constructions | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.