Hui-Ping JIAN
2Patents
0h-index
3Co-inventors
24Inventor score
Filing activity: May 14, 2020 → Dec 10, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11302647B2 | Semiconductor device package including conductive layers as shielding and method of manufacturing the same | Electricity | 0 | Active |
| US12237272B2 | Electronic device and method of manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.