Hyun Jong Woo
2Patents
1h-index
10Co-inventors
41Inventor score
Filing activity: Sep 5, 2007 → Mar 18, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7759795B2 | Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same | Emerging Cross-Sectional Technologies | 1 | Active |
| US12372558B2 | Device and method for measuring voltage by using optical element | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.