Jack Goodman
2Patents
2h-index
7Co-inventors
30Inventor score
Filing activity: Dec 19, 1997 → Dec 20, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5920120A | Assembly for dissipatating heat from a semiconductor chip wherein a stress on the semiconductor chip due to a thermally conductive member is partially relieved | Electricity | 38 | Expired |
| US7326561B2 | Flow-thru chip cartridge, chip holder, system and method thereof | Physics | 19 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.