Jamie Rieg
2Patents
0h-index
4Co-inventors
24Inventor score
Filing activity: Apr 26, 2017 → Jul 26, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10356913B2 | High speed solder deposition and reflow for a printed flexible electronic medium | Electricity | 0 | Active |
| US10064289B2 | High speed solder deposition and reflow for a printed flexible electronic medium | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.