Jane Hui
4Patents
2h-index
9Co-inventors
37Inventor score
Filing activity: Jul 12, 1999 → Dec 2, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6207554A | Gap filling process in integrated circuits using low dielectric constant materials | Electricity | 21 | Expired |
| US7585768B2 | Combined copper plating method to improve gap fill | Electricity | 11 | Active |
| US9054107B2 | Reliable interconnect for semiconductor device | Electricity | 1 | Active |
| US8598031B2 | Reliable interconnect for semiconductor device | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.