Jerry A. Corfman
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Dec 3, 1985 → Dec 3, 1985
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4775917A | Thermal compensated circuit board interconnect apparatus and method of forming the same | Emerging Cross-Sectional Technologies | 26 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.