Jim M. Spall
1Patents
1h-index
5Co-inventors
25Inventor score
Filing activity: Jun 29, 2007 → Jun 29, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7808788B2 | Multi-layer electrically isolated thermal conduction structure for a circuit board assembly | Electricity | 9 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.