John Dancaster
3Patents
3h-index
4Co-inventors
39Inventor score
Filing activity: Oct 1, 2003 → Sep 10, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6927482B1 | Surface mount package and method for forming multi-chip microsensor device | Electricity | 30 | Expired |
| US7157312B2 | Surface mount package and method for forming multi-chip microsensor device | Electricity | 9 | Expired |
| US8264074B2 | Device for use as dual-sided sensor package | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.