John E. Evert
1Patents
1h-index
3Co-inventors
25Inventor score
Filing activity: Oct 4, 2000 → Oct 4, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6709898B1 | Die-in-heat spreader microelectronic package | Electricity | 128 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.