John Gow, 3rd
4Patents
4h-index
13Co-inventors
47Inventor score
Filing activity: Jul 3, 1978 → Jun 6, 1991
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5168368A | Lead frame-chip package with improved configuration | Electricity | 214 | Expired |
| US5138430A | High performance versatile thermally enhanced IC chip mounting | Emerging Cross-Sectional Technologies | 144 | Expired |
| US5028983A | Multilevel integrated circuit packaging structures | Electricity | 59 | Expired |
| US4191938A | Cermet resistor trimming method | Emerging Cross-Sectional Technologies | 15 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.