Inventor · Waynesboro, PA, US

John J. Pollock

2Patents
2h-index
Co-inventors
31Inventor score

Filing activity: Oct 28, 1982 → May 30, 1996

Most-cited inventions

PatentTitleAreaCited byStatus
US4434112A Heat transfer surface with increased liquid to air evaporative heat exchange Emerging Cross-Sectional Technologies 42 Expired
US5770521A Anti-shear method and system for semiconductor wafer removal Performing Operations; Transporting 14 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.