Jun Hisada
3Patents
2h-index
4Co-inventors
30Inventor score
Filing activity: Apr 23, 2002 → Apr 16, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6733886B2 | Laminate and method of manufacturing the same | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7029761B2 | Bonding layer for bonding resin on copper surface | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7156904B2 | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.