Jun Shimormura
1Patents
1h-index
7Co-inventors
25Inventor score
Filing activity: Mar 14, 2012 → Mar 14, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8411415B2 | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor | Emerging Cross-Sectional Technologies | 60 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.