JungHwan Um
3Patents
1h-index
14Co-inventors
34Inventor score
Filing activity: Sep 2, 2016 → Nov 7, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10672629B2 | Ring assembly and chuck assembly having the same | Electricity | 5 | Active |
| US10892142B2 | System for fabricating a semiconductor device | Electricity | 0 | Active |
| US10312059B2 | Ring member with air holes and substrate processing system including the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.