Junhe WANG
2Patents
0h-index
4Co-inventors
27Inventor score
Filing activity: Jun 28, 2018 → Nov 25, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11133128B2 | System in package module assembly, system in package module, and electronic device | Electricity | 0 | Active |
| US12368082B2 | IGBT chip integrating temperature sensor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.