Kai C. Ng
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Oct 27, 2006 → Oct 27, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7573131B2 | Die-up integrated circuit package with grounded stiffener | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.