Keith Pasko
8Patents
2h-index
14Co-inventors
40Inventor score
Filing activity: Apr 9, 2013 → Mar 10, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11143467B2 | Membrane heat exchanger system and method | Mechanical Engineering; Lighting; Heating | 5 | Active |
| US9619587B2 | Decomposition of 3D geometry into developable surface patches and 2D cut patterns | Physics | 2 | Active |
| US9495484B2 | Nesting using rigid body simulation | Emerging Cross-Sectional Technologies | 1 | Active |
| US11203157B2 | Three-dimensional printing preparation | Physics | 0 | Active |
| US9767233B2 | Nesting using rigid body simulation | Emerging Cross-Sectional Technologies | 0 | Active |
| US10248740B2 | Three-dimensional printing preparation | Physics | 0 | Active |
| US11885577B2 | Heat exchanger array system and method for an air thermal conditioner | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US10783289B2 | Nesting using rigid body simulation | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.