Kenneth M. Wasko
5Patents
4h-index
10Co-inventors
50Inventor score
Filing activity: Jun 25, 1987 → Jul 29, 1996
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5323947A | Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement | Emerging Cross-Sectional Technologies | 43 | Expired |
| US5232758A | Non-hardening solvent removable hydrophobic conformal coatings | Emerging Cross-Sectional Technologies | 26 | Expired |
| US4752244A | Zero insertion force edge clip interconnect pin | Electricity | 12 | Expired |
| US5038466A | Multifunctional end effector and method of converting single purpose robot arm | Emerging Cross-Sectional Technologies | 10 | Expired |
| USD394044S | Front panel for infrastructure equipment | General | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.