Kim Phillippe
1Patents
1h-index
5Co-inventors
25Inventor score
Filing activity: Oct 8, 2002 → Oct 8, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6867978B2 | Integrated heat spreader package for heat transfer and for bond line thickness control and process of making | Electricity | 33 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.