King Yip Leung
1Patents
0h-index
2Co-inventors
16Inventor score
Filing activity: Dec 6, 2021 → Dec 6, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12262464B2 | Methods for forming engineered thermal paths of printed circuit boards by use of removable layers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.