Kousuke Hiroki
2Patents
0h-index
8Co-inventors
31Inventor score
Filing activity: Jul 10, 2007 → Dec 27, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8028402B2 | Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof | Emerging Cross-Sectional Technologies | 0 | Active |
| US11320430B2 | Magnetic particle dispersion | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.