Kuo-Chien Wang
2Patents
0h-index
4Co-inventors
24Inventor score
Filing activity: Dec 6, 2019 → Oct 29, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11189582B2 | Wire bond pad design for compact stacked-die package | Electricity | 0 | Active |
| US12051660B2 | Wire bond pad design for compact stacked-die package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.