Lawrence E. McKay
1Patents
1h-index
3Co-inventors
25Inventor score
Filing activity: Dec 19, 1997 → Dec 19, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5920120A | Assembly for dissipatating heat from a semiconductor chip wherein a stress on the semiconductor chip due to a thermally conductive member is partially relieved | Electricity | 38 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.