Lisa Windover
8Patents
5h-index
5Co-inventors
48Inventor score
Filing activity: May 31, 2002 → Jul 17, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6879032B2 | Folded flex circuit interconnect having a grid array interface | Electricity | 87 | Expired |
| US7263248B2 | Optical via to pass signals through a printed circuit board | Physics | 29 | Expired |
| US7466880B2 | Optical via to pass signals through a printed circuit board | Physics | 25 | Active |
| US7092641B2 | Method and apparatus for optical transmission of wavelength-encoded modulation formats | Electricity | 6 | Expired |
| US6870195B2 | Array of discretely formed optical signal emitters for multi-channel communication | Electricity | 6 | Expired |
| US7223924B2 | Via placement for layer transitions in flexible circuits with high density ball grid arrays | Electricity | 1 | Expired |
| US7020362B2 | Low cost optical interconnect for fiber optic system | Physics | 1 | Expired |
| US6973105B2 | Method and apparatus to enable adaptive equalization at high bandwidths when using single-mode VCSELs over multimode fibers | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.