Lois Illig
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: May 18, 1994 → May 18, 1994
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5571373A | Method of rough polishing semiconductor wafers to reduce surface roughness | Electricity | 52 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.