Mahadevan Survakumar
3Patents
2h-index
2Co-inventors
30Inventor score
Filing activity: Mar 27, 2003 → Nov 3, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8035218B2 | Microelectronic package and method of manufacturing same | Electricity | 14 | Active |
| US6787902B1 | Package structure with increased capacitance and method | Electricity | 2 | Expired |
| US6936498B2 | Package structure with increased capacitance and method | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.