Inventor · San Jose, CA, US

Mark R. Isaacson

1Patents
1h-index
2Co-inventors
22Inventor score

Filing activity: Jul 22, 1996 → Jul 22, 1996

Most-cited inventions

PatentTitleAreaCited byStatus
US5708419A Method of wire bonding an integrated circuit to an ultraflexible substrate Emerging Cross-Sectional Technologies 124 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.