Mark SIEJKA
2Patents
1h-index
5Co-inventors
33Inventor score
Filing activity: Sep 26, 2016 → Sep 15, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10098221B2 | Heat transfer assembly providing heat transfer from a module mounted on a circuit board through the circuit board | Electricity | 1 | Active |
| US11863145B1 | Automatic gain control (AGC) using a wideband RF tuner in RF amplifiers in a hybrid fiber-coaxial (HFC) network | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.