Michael Contreras
3Patents
1h-index
4Co-inventors
41Inventor score
Filing activity: Dec 18, 1995 → Dec 6, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5556506A | Method for forming a conductive layer of material on an integrated circuit substrate | Electricity | 6 | Expired |
| US11542788B2 | Drilling out frac plugs | Physics | 0 | Active |
| US12120118B1 | Securely communicating data between an application associated with an entity and a third-party system | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.