Inventor · Richfield, WI, US

Michael Neperud

4Patents
4h-index
5Co-inventors
47Inventor score

Filing activity: Jan 20, 1988 → Dec 14, 2007

Most-cited inventions

PatentTitleAreaCited byStatus
US7328547B2 Process for packaging plastic materials like hot melt adhesives Emerging Cross-Sectional Technologies 44 Expired
US4855335A Medical moisture resistant adhesive composition for use in the presence of moisture Chemistry; Metallurgy 39 Expired
US7572494B2 Process for packaging plastic materials like hot melt adhesives Emerging Cross-Sectional Technologies 13 Active
US7059760B2 Method of post mixing additives to hot melt adhesives Performing Operations; Transporting 9 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.