Michael T. Boldman
3Patents
3h-index
4Co-inventors
39Inventor score
Filing activity: Aug 8, 1991 → Jan 27, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5229016A | Method and apparatus for dispensing spherical-shaped quantities of liquid solder | Electricity | 115 | Expired |
| US6015083A | Direct solder bumping of hard to solder substrate | Electricity | 91 | Expired |
| US5772106A | Printhead for liquid metals and method of use | Electricity | 57 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.