Mike Ball
7Patents
2h-index
5Co-inventors
44Inventor score
Filing activity: May 3, 1993 → Mar 2, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5322207A | Method and apparatus for wire bonding semiconductor dice to a leadframe | Electricity | 108 | Expired |
| US11316700B1 | Distributed ledger-based ad-hoc system, apparatus and method | Electricity | 8 | Active |
| US11429958B1 | System, method and apparatus for resource access control | Physics | 1 | Active |
| US12032556B2 | Distributed machine learning architecture with hybrid data normalization, proof of lineage and data integrity | Physics | 1 | Active |
| US12244744B2 | Distributed ledger-based system, method and apparatus for managing tasks | Electricity | 0 | Active |
| US11539715B1 | Distributed ledger-based ad-hoc system, apparatus and method using fingerprint verification | Electricity | 0 | Active |
| US11431508B1 | Distributed ledger-based ad-hoc system, apparatus and method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.