Mike Kwon
24Patents
4h-index
13Co-inventors
56Inventor score
Filing activity: Sep 10, 2003 → May 25, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8748202B2 | Substrate free LED package | Electricity | 23 | Active |
| US9130139B2 | Packaging photon building blocks having only top side connections in a molded interconnect structure | Electricity | 6 | Active |
| US9653437B2 | Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate | Electricity | 6 | Active |
| US7136673B2 | Telephony terminal | Electricity | 5 | Expired |
| US8652860B2 | Packaging photon building blocks having only top side connections in a molded interconnect structure | Electricity | 3 | Active |
| US7107071B1 | Integration of fixed wireless terminal with broadcast radio receiving devices | Electricity | 3 | Expired |
| US8682278B2 | Telephony terminal | Electricity | 1 | Active |
| US7117007B2 | Enhanced mobility wireless local loop phone | Electricity | 1 | Expired |
| US9420110B2 | Telephony terminal | Electricity | 1 | Active |
| US10609195B2 | Telephony terminal | Electricity | 1 | Active |
| US11025763B2 | Telephony terminal | Electricity | 1 | Active |
| US7995987B2 | Telephony terminal | Electricity | 1 | Active |
| US9893039B2 | Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate | Electricity | 1 | Active |
| US10148802B2 | Telephony terminal | Electricity | 1 | Active |
| US8536605B2 | Micro-bead blasting process for removing a silicone flash layer | Electricity | 1 | Active |
| US11363127B2 | Telephony terminal | Electricity | 0 | Active |
| US10714533B2 | Substrate free LED package | Electricity | 0 | Active |
| US8610153B1 | Micro-bead blasting process for removing a silicone flash layer | Electricity | 0 | Active |
| US9985004B2 | Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate | Electricity | 0 | Active |
| US10325890B2 | Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate | Electricity | 0 | Active |
| US9627436B2 | Substrate free LED package | Electricity | 0 | Active |
| US7363062B2 | Enhanced mobility wireless local loop phone | Electricity | 0 | Active |
| US9312465B2 | Packaging photon building blocks having only top side connections in a molded interconnect structure | Electricity | 0 | Active |
| US8803180B2 | Micro-bead blasting process for removing a silicone flash layer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.