Mike Lapinsky
3Patents
2h-index
3Co-inventors
30Inventor score
Filing activity: Jun 11, 2014 → Sep 26, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9329993B2 | Wearable device assembly with ability to mitigate data loss due to component failure | Physics | 4 | Active |
| US9804792B2 | Wearable device assembly with ability to mitigate data loss due to component failure | Physics | 3 | Active |
| US10126965B2 | Wearable device assembly with ability to mitigate data loss due to component failure | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.