Min-Che TSAI
4Patents
1h-index
4Co-inventors
33Inventor score
Filing activity: Jun 26, 2018 → Apr 20, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11123821B2 | Laser cutting method | Performing Operations; Transporting | 1 | Active |
| US11949056B2 | Light emitting diode packaging structure | Electricity | 0 | Active |
| US11670749B2 | Method for manufacturing light emitting diode packaging structure | Electricity | 0 | Active |
| US11296269B2 | Light emitting diode packaging structure and method for manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.