Mingchuan Han
1Patents
0h-index
5Co-inventors
19Inventor score
Filing activity: Aug 30, 2021 → Aug 30, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11784112B2 | Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.