Misato Honda
2Patents
1h-index
5Co-inventors
30Inventor score
Filing activity: Jun 7, 2013 → Jul 23, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9955583B2 | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board | Electricity | 8 | Active |
| US9211241B2 | Oral composition | Human Necessities | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.