Mitsuru Ohida
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: Jul 3, 1996 → Jul 3, 1996
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5786271A | Production of semiconductor package having semiconductor chip mounted with its face down on substrate with protruded electrodes therebetween and semiconductor package | Electricity | 58 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.