Pengnian Wang
1Patents
1h-index
5Co-inventors
25Inventor score
Filing activity: Jun 10, 2015 → Jun 10, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10163762B2 | Lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.