Peter McNally
3Patents
2h-index
5Co-inventors
41Inventor score
Filing activity: Mar 24, 1989 → Nov 23, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5354386A | Method for plasma etching tapered and stepped vias | Electricity | 30 | Expired |
| US9196587B2 | Semiconductor device having a die and through substrate-via | Electricity | 5 | Active |
| US9659900B2 | Semiconductor device having a die and through-substrate via | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.