Inventor · Oberwil, CH

Philipp Loeffel

2Patents
1h-index
4Co-inventors
33Inventor score

Filing activity: Nov 22, 2012 → Dec 1, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US9261385B2 Housing cap for an electronics housing, respectively electronics housing fromed therewith Electricity 3 Active
US12007025B2 Assembly, housing cover having an assembly of this type, and field device having a housing cover of this type Mechanical Engineering; Lighting; Heating 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.