Phillip Welsh
1Patents
1h-index
3Co-inventors
25Inventor score
Filing activity: Aug 19, 2004 → Aug 19, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7230512B1 | Wafer-level surface acoustic wave filter package with temperature-compensating characteristics | Electricity | 24 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.