Ping Miao
3Patents
1h-index
13Co-inventors
41Inventor score
Filing activity: Oct 30, 2002 → Jun 21, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7087458B2 | Method for fabricating a flip chip package with pillar bump and no flow underfill | Electricity | 55 | Expired |
| US11471872B2 | Pure phase ε/ε' iron carbide catalyst for Fischer-Tropsch synthesis reaction, preparation method thereof and Fischer-Tropsch synthesis process | Emerging Cross-Sectional Technologies | 0 | Active |
| US11007510B2 | Supported ε/ε′ iron carbide catalyst for Fischer-Tropsch synthesis reaction, preparation method thereof and Fischer-Tropsch synthesis process | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.