Qiuling Jia
3Patents
1h-index
10Co-inventors
37Inventor score
Filing activity: Jul 3, 2013 → Dec 4, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8815730B1 | Method for forming bond pad stack for transistors | Electricity | 3 | Active |
| US9030023B2 | Bond pad stack for transistors | Electricity | 1 | Active |
| US10903345B2 | Power MOSFET with metal filled deep sinker contact for CSP | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.