Ralph Edward Cornell
4Patents
4h-index
7Co-inventors
36Inventor score
Filing activity: Mar 23, 1995 → Nov 24, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5607099A | Solder bump transfer device for flip chip integrated circuit devices | Electricity | 183 | Expired |
| US5547740A | Solderable contacts for flip chip integrated circuit devices | Emerging Cross-Sectional Technologies | 139 | Expired |
| US5926731A | Method for controlling solder bump shape and stand-off height | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6184581A | Solder bump input/output pad for a surface mount circuit device | Emerging Cross-Sectional Technologies | 11 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.