Ramzi Vincent
2Patents
1h-index
10Co-inventors
34Inventor score
Filing activity: Jun 15, 2006 → Aug 29, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8882301B2 | Method for low temperature bonding of electronic components | Emerging Cross-Sectional Technologies | 3 | Active |
| US8336457B2 | Reactive composite material structures with electrostatic discharge protection and applications thereof | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.